Diamond Wire Cutting Wafer

Afterwards the wafers can be separated from the carrier plate without any residues.

Diamond wire cutting wafer.

The diamond wire cutting head is used whenever there is a requirement to produce a cut with minimum surface and sub surface damage. Siemens offers optimized automation concepts for high performance ingot cutting machines. We offer contract slicing using diamond wire. 20 μm 20 μm results subject to change based on process material and cutting orientation parameters cropless ingot process diamond wire.

Slicingtech serves the needs of companies who require high precision high volume wafer slicing. Logitech s model 15 diamond wire disc saw is a compact saw ideal for the precision slicing and dicing of materials from the most delicate crystals to the hardest ceramics. Abrasive slurry saw wire with abrasive slurry diamond wire without abrasive slurry silicon. This is done in baths with hot water or diluted acid.

The working principle is that under a certain tension the wire saw grinds and cuts the object removes the debris and heat with cooling water and finally divides. 32 n 35 n cut time 180 minutes 150 minutes tv5. You can request information concerning quantity details and prices by contacting us or filling in the form. Along with a wide range of meyer burger slicing systems we now feature the world renowned state of the art meyer burger dw 288 and meyer burger dw 265 diamond wire slicing systems for hard and brittle.

15 μm 15 μm bow. Along with a wide range of meyer burger wafer slicing systems we now feature the world renowned state of the art meyer burger dw 288 diamond wire slicing systems for hard and brittle materials. 310 μm feed rate. 12 m sec 12 m sec wire tension.

200 μm 250 μm wire speed. It is important that the adhesive does not contaminate the debonding bath and the silicon but adheres to the carrier. Wire saw contract cutting and wafer slicing slicingtech serves the needs of companies who require high precision high volume wafer slicing. The new environmentally friendly diamond wire technology for wire saws doubles the cutting speed of saws.

Wafer production places high demands on the technology used while the market demands maximum efficiency from manufacturers. Our lead times are short and we can accommodate requirements from r d to production quantities. 15 μm 15 μm warp. The diamond wire slicing process we employ provides our customers less kerf loss with outstanding finishes to micron level tolerances.